ACHILLES CORPORATION [Achilles]

 

PRODUCTS

Wafer Handling System

200mm ring: Contactless type
Conductive Inner Ring T-WSR200X

By using the inner ring T-WSR200X in combination with NA-8M, bump wafers, surface mount wafers, glass wafers, etc. can be stored and transported in a non-contact manner.
Also, it can be used repeatedly.

Features

  • No contact with wafer for transport
  • Low particle
  • Low ion contamination
  • Low outgassing
  • Uses a clean conductive material “ST Poly” 

Specification

Model number
T-WSR200X
Material
Conductive PC
Surface resistance value
R < 1.0×107Ω
Carton size (500pcs/carton)
430mm × 420mm × 290mm 5.5kg

Ion contamination comparison

Sample Anion Cation
F Cl NO2 Br NO3 SO4 PO4 Li Na NH4 K Mg Ca
T-WSR200X ND ND ND ND ND ND ND ND ND ND ND ND ND

*This data is an actual measurement value, not a guaranteed value

Click here for product introduction. Please feel free to contact us .

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