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PRODUCTS
Wafer Handling System
200mm ring: Contactless type
Conductive Inner Ring T-WSR200X
By using the inner ring T-WSR200X in combination with NA-8M, bump wafers, surface mount wafers, glass wafers, etc. can be stored and transported in a non-contact manner.
Also, it can be used repeatedly.
Also, it can be used repeatedly.
Features
- No contact with wafer for transport
- Low particle
- Low ion contamination
- Low outgassing
- Uses a clean conductive material “ST Poly”
Specification
- Model number：
- T-WSR200X
- Material：
- Conductive PC
- Surface resistance value：
- R < 1.0×107Ω
- Carton size (500pcs/carton)：
- 430mm × 420mm × 290mm 5.5kg
Ion contamination comparison
| Sample | Anion | Cation | |||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| F | Cl | NO2 | Br | NO3 | SO4 | PO4 | Li | Na | NH4 | K | Mg | Ca | |
| T-WSR200X | ND | ND | ND | ND | ND | ND | ND | ND | ND | ND | ND | ND | ND |
*This data is an actual measurement value, not a guaranteed value
