PRODUCTS
Wafer Handling System
200mm Horizontal Wafer Shipper (8inch) contactless type
Protos Carrier NA-8M
Horizontal Wafer Shipper (ESD Supported)

Achilles’ Wafer Package System can transfer your wafers both safely and efficiently. Based on our proven technology nurtured by years of experience, this wafer package system can transfer such highly fragile wafers as thin wafers for TSV chips and compound wafers.
Features
- Inner rings (T-WSR200X) for non-contact transportation are available. (Sold separately)
- For 200mm wafers. Maximum storage capacity of 25 wafers.
- Made from low particles/ionic/outgassing material
- ESD safe / Conforms to ANSI / ESD S541.
- Damage during transportation is reduced by double wall instruction
- Compatible with automatic wafer packing equipment.
Specification
- Model number:
- NA-8M
- Material:
- Container Body PP/(Polypropylene) carbon included,
- Surface resistance value:
- 10^4 Ω < R < 10^9 Ω
- Wafer storage diameter:
- 202±1mm
- Height of storage:
- 69.0mm
- product size:
- 93mm × 226mm × 226mm 0.59kg
- Carton size (10pcs/carton):
- 480mm × 460mm × 260mm 7.0kg
Options
- Inner ring
- Pink or black inner foam
- Moisture barrier bags
Recommended combination
For Memory | For Logic |
For Image Sensor For Glass |
||
---|---|---|---|---|
foam | MA-8PEAS-□※1 | ◯ | ◯ | |
MA-8PESD-■※2 | ◯ | |||
interleaf | PEA-8-350(Z1) | ◯ | ||
CPS-8-350(Z2) | ◯ | ◯ | ||
T-WSR200X | ◯ |
※1 □:1/3/5/6/10
※2 ■:1/3/5/10
PEAS,PEA : Antistatic Type
PESD,CPS,T-WSR200X : Conductive Type
How to store
8inch = 200mm wafer / 25 wafers can be stored

【Example :100μmT wafer】

※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.
Cushion stacking guideline

Cushion stacking guideline
* Mark: edge