Semiconductor transfer and handling solution [ACHILLES CORPORATION]

PRODUCTS

Wafer Handling System

200mm Horizontal Wafer Shipper (8inch) contactless type
Protos Carrier NA-8M
Horizontal Wafer Shipper (ESD Supported)

Achilles’ Wafer Package System can transfer your wafers both safely and efficiently. Based on our proven technology nurtured by years of experience, this wafer package system can transfer such highly fragile wafers as thin wafers for TSV chips and compound wafers.

Features

Inner rings (T-WSR200X) for non-contact transportation are available. (Sold separately)
For 200mm wafers. Maximum storage capacity of 25 wafers.
Made from low particles/ionic/outgassing material
ESD safe / Conforms to ANSI / ESD S541.
Damage during transportation is reduced by double wall instruction
Compatible with automatic wafer packing equipment.

Specification

Model number：: NA-8M

Material：: Container Body PP／（Polypropylene） carbon included,

Surface resistance value：: 10^4 Ω < R < 10^9 Ω

Wafer storage diameter：: 202±1mm

Height of storage：: 69.0mm

product size：: 93mm × 226mm × 226mm　0.59kg

Carton size (10pcs/carton)：: 480mm × 460mm × 260mm　7.0kg

Options

Inner ring
Pink or black inner foam
Moisture barrier bags

Recommended combination

		For Memory	For Logic	For Image Sensor For Glass
foam	MA-8PEAS-□^※1	◯		◯
foam	MA-8PESD-■^※2		◯
interleaf	PEA-8-350(Z1)	◯
	CPS-8-350(Z2)	◯	◯
	T-WSR200X			◯

※1 □：1/3/5/6/10
※2 ■：1/3/5/10

PEAS,PEA : Antistatic Type

PESD,CPS,T-WSR200X : Conductive Type

How to store

8inch = 200mm wafer　/　25 wafers can be stored

【Example ：100μｍT wafer】

※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.

Cushion stacking guideline

Cushion stacking guideline
＊ Mark: edge

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