PRODUCTS

Wafer Handling System

200mm Horizontal Wafer Shipper (8inch) contactless type
Protos Carrier NA-8M
Horizontal Wafer Shipper (ESD Supported)

 
Achilles’ Wafer Package System can transfer your wafers both safely and efficiently. Based on our proven technology nurtured by years of experience, this wafer package system can transfer such highly fragile wafers as thin wafers for TSV chips and compound wafers.

Features

  • Inner rings  (T-WSR200X) for non-contact transportation are available. (Sold separately)
  • For 200mm wafers. Maximum storage capacity of 25 wafers.
  • Made from low particles/ionic/outgassing material
  • ESD safe / Conforms to ANSI / ESD S541.
  • Damage during transportation is reduced by double wall instruction
  • Compatible with automatic wafer packing equipment.

Specification

Model number
NA-8M
Material
Container Body PP/(Polypropylene) carbon included,
Surface resistance value
10^4 Ω < R < 10^9 Ω
Wafer storage diameter
202±1mm
Height of storage
69.0mm
product size
93mm × 226mm × 226mm 0.59kg
Carton size (10pcs/carton)
480mm × 460mm × 260mm 7.0kg

Options

  • Inner ring
  • Pink or black inner foam
  • Moisture barrier bags

Recommended combination

  For Memory For Logic

For Image Sensor

For Glass

foam MA-8PEAS-□※1  
MA-8PESD-■※2    
interleaf PEA-8-350(Z1)    
CPS-8-350(Z2)  
T-WSR200X    

※1 □:1/3/5/6/10
※2 ■:1/3/5/10

PEAS,PEA : Antistatic Type 

PESD,CPS,T-WSR200X : Conductive Type 

How to store

8inch = 200mm wafer / 25 wafers can be stored

【Example 100μT wafer】


※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.

Cushion stacking guideline

Cushion stacking guideline
* Mark: edge

Click here for product introduction. Please feel free to contact us .

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