Wafer Handling System

300mm Horizontal Wafer Shipper (12inch)
Protos Carrier NA-300LA
Horizontal Wafer Shipper (ESD Supported)


Achilles’ Wafer Package System can transfer your wafers both safely and efficiently. Based on our proven technology nurtured by years of experience, this wafer package system can transfer such highly fragile wafers as thin wafers for TSV chips and compound wafers.


  • For 300mm wafers. Maximum storage capacity of 25 wafers.
  • Made from low particles/ionic/outgassing material
  • ESD safe / Conforms to ANSI / ESD S541.
  • Damage during transportation is reduced by holding the wafer with the Compression TabTM.
  • Compatible with automatic wafer packing equipment.


Model number
Container Body PP/(Polypropylene)carbon included,
Surface resistance value
10^4Ω < R < 10^9Ω
Wafer storage diameter
Height of storage
product size
79mm × 328mm × 328mm 1.19kg
Carton size (12pcs/carton)


  • Insert /Interleaf
  • Pink or black inner foam
  • Moisture barrier bags

Recommended combination

  For Memory For Logic
cushion MA-12PEAS-□※1  
interleaf PEA-12-350(Z1)  


PEAS,PEA : Antistatic Type 

PESD,CPS : Conductive Type 

How to store

12inch = 300mm wafer / 25 wafers can be stored

【Example 100μT wafer】

※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.

Cushion stacking guideline

The corner base point is a guideline for stacking cushions.

LPC measurement

IC measurement

  For Memory For Logic
item F Cl NO2- Br NO3- SO42- PO43- Li+ Na+ NH4+ K+ Mg2+ Ca2+
result ND 1.2 ND ND ND ND ND ND ND ND ND ND 1.4

Drop Test


Item Qty. Part Number Description
1 1 MA-12PEAS-6(REV 1) Cushion, Ф300mmX6mmt
2 25 Si Wafer Wafer, Ф300mmX0.775mmt
3 26 CPS-12-350(Z2) Interleaf, Ф300mmX0.35mmt
4 2 MA-12PEAS-6(REV 1) Cushion, Ф300mmX6mmt
5 Outer cushion Styrene Foam
6 1 Carton 440mm×440mm×180mm

・Drop Direction: 10 directions (1 corner / 3 edges / 6 sides)


Drop Condition Drop Condition Result Wafer State
Drop Height: 100 cm
Free fall to concrete floor
ISO 2248:1985

Wafer Thickness:775 μm

[N/W: 4.7 kg]
[G/W: 5.7 kg]
1 Corner No cracking
2 Edge No cracking
3 Edge No cracking
4 Edge No cracking
5 Edge No cracking
6 Edge No cracking
7 Edge No cracking
8 Edge No cracking
9 Side(TOP) No cracking
10 Side(BTM) No cracking

* We dropped it from the height of 100 cm (Severe Level!!) to the concrete floor.
based on the evaluation method of ISO 2248:1985.

Click here for product introduction. Please feel free to contact us .

Contact Us