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PRODUCTS
Wafer Handling System
300mm Horizontal Wafer Shipper (12inch)
Protos Carrier NA-300LA
Horizontal Wafer Shipper (ESD Supported)
Achilles’ Wafer Package System can transfer your wafers both safely and efficiently. Based on our proven technology nurtured by years of experience, this wafer package system can transfer such highly fragile wafers as thin wafers for TSV chips and compound wafers.
Features
- For 300mm wafers. Maximum storage capacity of 25 wafers.
- Made from low particles/ionic/outgassing material
- ESD safe / Conforms to ANSI / ESD S541.
- Damage during transportation is reduced by holding the wafer with the Compression TabTM.
- Compatible with automatic wafer packing equipment.
Specification
- Model number：
- NA-300LA
- Material：
- Container Body PP／（Polypropylene）carbon included,
- Surface resistance value：
- 10^4Ω < R < 10^9Ω
- Wafer storage diameter：
- 301.9+1/-0.9mm
- Height of storage：
- 44.0mm
- product size：
- 79mm × 328mm × 328mm 1.19kg
- Carton size (12pcs/carton)
Options
- Insert /Interleaf
- Pink or black inner foam
- Moisture barrier bags
Recommended combination
| For Memory | For Logic | ||
|---|---|---|---|
| cushion | MA-12PEAS-□※1 | ◯ | |
| MA-12PESD-■※2 | ◯ | ||
| interleaf | PEA-12-350(Z1) | ◯ | |
| CPS-12-350(Z2) | ◯ | ◯ | |
＊□：1/3/5/6/10
＊■：1/3/5/10
PEAS,PEA : Antistatic Type
PESD,CPS : Conductive Type
How to store
12inch = 300mm wafer / 25 wafers can be stored
【Example ：100μｍT wafer】
※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.
Cushion stacking guideline
The corner base point is a guideline for stacking cushions.
LPC measurement
IC measurement
| For Memory | For Logic | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| item | F– | Cl– | NO2- | Br– | NO3- | SO42- | PO43- | Li+ | Na+ | NH4+ | K+ | Mg2+ | Ca2+ |
| result | ND | 1.2 | ND | ND | ND | ND | ND | ND | ND | ND | ND | ND | 1.4 |
Drop Test
Method
| Item | Qty. | Part Number | Description |
|---|---|---|---|
| 1 | 1 | MA-12PEAS-6(REV 1) | Cushion, Ф300mmX6mmt |
| 2 | 25 | Si Wafer | Wafer, Ф300mmX0.775mmt |
| 3 | 26 | CPS-12-350(Z2) | Interleaf, Ф300mmX0.35mmt |
| 4 | 2 | MA-12PEAS-6(REV 1) | Cushion, Ф300mmX6mmt |
| 5 | – | Outer cushion | Styrene Foam |
| 6 | 1 | Carton | 440mm×440mm×180mm |
・Drop Direction: 10 directions (1 corner / 3 edges / 6 sides)
Result
| Drop Condition | Drop Condition | Result Wafer State |
|---|---|---|
| Drop Height: 100 cm Free fall to concrete floor ISO 2248:1985 Wafer Thickness:775 μm [N/W: 4.7 kg] [G/W: 5.7 kg] |
1 Corner | No cracking |
| 2 Edge | No cracking | |
| 3 Edge | No cracking | |
| 4 Edge | No cracking | |
| 5 Edge | No cracking | |
| 6 Edge | No cracking | |
| 7 Edge | No cracking | |
| 8 Edge | No cracking | |
| 9 Side(TOP) | No cracking | |
| 10 Side(BTM) | No cracking |
* We dropped it from the height of 100 cm (Severe Level!!) to the concrete floor.
based on the evaluation method of ISO 2248:1985.
