PRODUCTS
Wafer Handling System
300mm Multiple Film Frame Shipper (12inch) 25wafer store type
Protos Carrier NDM-12M
Film Frame Shipper (ESD Supported)

Achilles’ ND series can transfer your wafers both safely and efficiently. Since the wafer can be transported while it is attached to the tape frame, the time and effort required to put the wafer in the tray can be reduced.
Features
- For 300mm wafers. Maximum storage capacity of 25 wafers.
- Wafers can be stored with a tape frame.
- Made from low particles/ionic/outgassing material
- Light weight when used with Protos Frames. (Sold separately)
- ESD safe / Conforms to ANSI / ESD S541.
- Compatible with automatic wafer packing equipment.
Specification
- Model number:
- NDM-12M
- Material:
- Container Body PP/(Polypropylene)carbon included,
- Surface resistance value:
- 10^4Ω < R < 10^9 Ω
- Wafer storage diameter:
- 402+0.5/-1.5mm
- Height of storage:
- 54.5mm
- product size:
- 92.5mm × 430mm × 430mm 2.07kg
- Carton size (4pcs/carton):
- 455mm × 365mm × 470mm 9.5kg
Options
- Insert /Interleaf
- Pink or black inner cushions
- Moisture barrier bags
Recommended combination
For Memory | For Logic |
For Image Sensor For Glass |
||
---|---|---|---|---|
cushion | MA-16PEAS-□※1 | ◯ | ◯ | |
MA-16PESD-■※2 | ◯ | |||
interleaf | PEA-15.5-350(Z1) | ◯ | ||
CPS-15.5-350(Z2) | ◯ | ◯ | ◯ |
※1 □:1/3/5/6/10
※2 ■:1/3/5/10
PEAS,PEA : Antistatic Type
PESD,CPS : Conductive Type
How to store
12inch = 300mm wafer mounted on dicing frames / 25 wafers can be stored

【Example :1.5mmT film frame】

※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.
Cushion stacking guideline

Cushion stacking guideline
* Mark: ribs
Drop Test
Method
We dropped it from the height of 100 cm(Severe Level) to the concrete floor.
Item | Qty. | Part Number | Description |
---|---|---|---|
1 | 1 | MA-16PEAS-6 | Cushion Ф400mmX6mmt |
2 | 25 | Si Wafer | Wafer, Ф300mmX0.775mmt |
3 | 25 | Frame | DISCO(DTF2-12) |
4 | 26 | PEA-15.5-350(Z1) | Interleaf, Ф395mmX0.35mmt |
5 | 1 | MA-16PEAS-6 | Cushion, Ф400mmX6mmt |
6 | 1 | Outer cushion | Styrene Foam |
7 | 1 | Carton | 510mmX510mmX200mm |
・Drop Direction: 10 directions (1 corner / 3 edges / 6 sides)

Result
Drop Condition | Drop Condition | Result Wafer State |
---|---|---|
Drop Height: 100 cm Free fall to concrete floor ISO 2248:1985 Wafer Thickness:775 μm [N/W: 13.3 kg] [G/W: 15.7 kg] |
1 Corner | No cracking |
2 Edge | No cracking | |
3 Edge | No cracking | |
4 Edge | No cracking | |
5 Edge | No cracking | |
6 Edge | No cracking | |
7 Edge | No cracking | |
8 Edge | No cracking | |
9 Side(TOP) | No cracking | |
10 Side(BTM) | No cracking |
* We dropped it from the height of 100 cm (Severe Level!!) to the concrete floor.
based on the evaluation method of ISO 2248:1985.