Wafer Handling System

300mm Multiple Film Frame Shipper (12inch) 25wafer store type
Protos Carrier NDM-12M
Film Frame Shipper (ESD Supported)

Achilles’ ND series can transfer your wafers both safely and efficiently. Since the wafer can be transported while it is attached to the tape frame, the time and effort required to put the wafer in the tray can be reduced.


  • For 300mm wafers. Maximum storage capacity of 25 wafers.
  • Wafers can be stored with a tape frame.
  • Made from low particles/ionic/outgassing material
  • Light weight when used with Protos Frames. (Sold separately)
  • ESD safe / Conforms to ANSI / ESD S541.
  • Compatible with automatic wafer packing equipment.


Model number
Container Body PP/(Polypropylene)carbon included,
Surface resistance value
10^4Ω < R < 10^9 Ω
Wafer storage diameter
Height of storage
product size
92.5mm × 430mm × 430mm 2.07kg
Carton size (4pcs/carton)
455mm × 365mm × 470mm 9.5kg


  • Insert /Interleaf
  • Pink or black inner cushions
  • Moisture barrier bags

Recommended combination

  For Memory For Logic

For Image Sensor

For Glass

cushion MA-16PEAS-□※1  
interleaf PEA-15.5-350(Z1)    

※1 □:1/3/5/6/10
※2 ■:1/3/5/10

PEAS,PEA : Antistatic Type 

PESD,CPS : Conductive Type 

How to store

12inch = 300mm wafer mounted on dicing frames / 25 wafers can be stored

【Example :1.5mmT film frame

※Inner foam thickness changes depending on the thickness of the wafer.
※This package example does not guarantee that the wafer will not crack.

Cushion stacking guideline

Cushion stacking guideline
* Mark: ribs

Drop Test


We dropped it from the height of 100 cm(Severe Level) to the concrete floor.

Item Qty. Part Number Description
1 1 MA-16PEAS-6 Cushion Ф400mmX6mmt
2 25 Si Wafer Wafer, Ф300mmX0.775mmt
3 25 Frame DISCO(DTF2-12)
4 26 PEA-15.5-350(Z1) Interleaf, Ф395mmX0.35mmt
5 1 MA-16PEAS-6 Cushion, Ф400mmX6mmt
6 1 Outer cushion Styrene Foam
7 1 Carton 510mmX510mmX200mm

・Drop Direction: 10 directions (1 corner / 3 edges / 6 sides)


Drop Condition Drop Condition Result Wafer State
Drop Height: 100 cm
Free fall to concrete floor
ISO 2248:1985

Wafer Thickness:775 μm

[N/W: 13.3 kg]
[G/W: 15.7 kg]
1 Corner No cracking
2 Edge No cracking
3 Edge No cracking
4 Edge No cracking
5 Edge No cracking
6 Edge No cracking
7 Edge No cracking
8 Edge No cracking
9 Side(TOP) No cracking
10 Side(BTM) No cracking

* We dropped it from the height of 100 cm (Severe Level!!) to the concrete floor.
based on the evaluation method of ISO 2248:1985.

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