ACHILLES CORPORATION [Achilles]

 

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Conductive tape

Protective tape
For chemical etching, photolithography, and plating processes

This is a conductive protective tape used in semiconductor manufacturing processes (chemical etching, photolithography, and plating). This tape is resistant to chemicals used in manufacturing semiconductors (PGME, PGMEA, TMAH, etching liquids, etc.) and protects wafer surfaces from chemical contamination.

Features

  • Conductive tape that can be used in chemical etching, photolithography, and plating processes.
  • The base material has excellent chemical resistance.
  • Even if exposed to chemicals, the tape does not peel off or change in appearance and adhesion.
  • The tape is also excellent in heat resistance and can be used in a drying process immediately after chemical treatment.

Specification

Model number
①STSI-PEN#25 ②STSI-PI#25
Material
①Conductive PEN ② Conductive PI
Width
240±2mm (For φ200mm) or 330±2mm (For φ300mm)
Length
20m or 80m
Base Film Thickness
25±2μm
Total Thickness
40±4μm

*The film thickness can be changed.

Configuration image

Physical property 

  Unit STSI-PEN#25 STSI-PI#25 Measurement
Surface resistivity Ω/□ 1.3×105 1.3×105 High resistivity meter
Surface resistivity
(Adhesive site)
Ω/□ >1.3×1013 >1.3×1013 High resistivity meter
Decay time sec <0.3 <0.3 FTM 101C-4046
(23℃×15%RH)

Adhesive strength

(vs Glass)

N/25mm 0.2 0.2 Peeling Speed : 300mm/min
Peeling Angle : 170°
Outgassing μg/g 34 43 170℃ 10min.
Transparency rate % 75 47 JIS K 7105

*This data is an actual measurement value, not a guaranteed value.

Chemical property

Chemical Surface resistance Dimension
(mm)
Appearance Adhesive
Before
(Ω/□)
After
(Ω/□)
Copper plating liquid Copper Sulfate 1.2E+04 2.1E+05 Not change Not change Not change
Organic Solvent PGME 1.2E+04 2.1E+06 Not change Not change Not change
PGMEA 1.2E+04 1.2E+06 Not change Not change Not change
1% Sodium carbonate 1.2E+04 1.2E+06 Not change Not change Not change
3%TMAH liquid 1.2E+04 3.2E+07 Not change Not change Not change
Etching liquid (Cu, pH=1) 1.2E+04 3.9E+05 Not change Not change Not change
Hydrogen peroxide water + Potassium hydroxide (pH=8.5) 1.2E+04 7.7E+11 Not change Not change Not change

*This data is an actual measurement value, not a guaranteed value.

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