Conductive thermal foam tape
This is a conductive thermal foam tape for temporarily fixing ultra-small parts in semiconductor and electronics manufacturing processes. When the tape is heated to a specified temperature, the beads in it foam and it loses its adhesion. By taking advantage of our unique technologies, we succeeded in producing conductive films and a conductive adhesive. Its excellent antistatic performance makes the tape safe to use in wafer and electronic part manufacturing processes.
- Tape comprised of conductive films and a conductive adhesive
- The tape can be used in semiconductor and electronic part manufacturing processes.
- Heating the tape to a specified temperature causes it to lose its adhesion.
Physical property comparison
|Base film||Conductive PET||PET|
|Surface Resistance [Ω]||Film side||2.5 × 105||Over 1.0 × 1014|
|Adhesive side||1.2 × 1012||Over 1.0 × 1014|
|Peel Electrification Voltage [V]
|Peeling angle 180°||20||Over 2,000|
|Peeling angle 0°||50||Over 2,000|
This data is an actual measurement value, not a guaranteed value.