Conductive tape

Conductive thermal foam tape

This is a conductive thermal foam tape for temporarily fixing ultra-small parts in semiconductor and electronics manufacturing processes. When the tape is heated to a specified temperature, the beads in it foam and it loses its adhesion. By taking advantage of our unique technologies, we succeeded in producing conductive films and a conductive adhesive. Its excellent antistatic performance makes the tape safe to use in wafer and electronic part manufacturing processes.


  • Tape comprised of conductive films and a conductive adhesive
  • The tape can be used in semiconductor and electronic part manufacturing processes.
  • Heating the tape to a specified temperature causes it to lose its adhesion.

Physical property comparison

  Achilles Competitor
Base film Conductive PET PET
Surface Resistance [Ω] Film side 2.5 × 105 Over 1.0 × 1014
Adhesive side 1.2 × 1012 Over 1.0 × 1014
Peel Electrification Voltage [V]
Thermal Foaming
Adhesive Side
Peeling angle 180° 20 Over 2,000
Peeling angle 0° 50 Over 2,000

This data is an actual measurement value, not a guaranteed value.

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