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PRODUCTS
Conductive tape
Heat-resistant conductive tape (non-silicon type)
This is a conductive tape used in baking processes in manufacturing CMOS and other semiconductors or electronics. Using our own heat-resistant acryl glue, the tape does not generate siloxane, which contaminates wafers and electronic parts. In addition, using a conductive polyimide (PI) film and conductive polyethylene naphthalate (PEN) film as antistatic measures, the tape is safe to use with wafers and electronic parts.
Features
- Using heat-resistant acryl glue, the tape does not generate siloxane(silicon free).
- The tape causes less peeling electric charge on wafers and electronic parts.
- The base material and adhesive have heat resistance.
Heat-resistant temperature of PI: 200℃
Specification
- Model number：
- ①ST-PEN#25A925 ②ST-PI#25A925
- Material：
- ①Conductive PEN ② Conductive PI
- Width：
- 240±2mm (For φ200mm) or 330±2mm (For φ300mm)
- Length：
- 20m or 80m
- Base Film Thickness：
- 25±2μｍ
- Total Thickness：
- 40±4μｍ
*The film thickness can be changed.
Configuration image
Physical property
| Unit | ST-PEN#25A925 | ST-PI#25A925 | Measurement | |
|---|---|---|---|---|
| Surface resistivity | Ω/□ | 1.3×105 | 1.3×105 | High resistivity meter |
| Surface resistivity (Adhesive site) |
Ω/□ | >1.3×1013 | >1.3×1013 | High resistivity meter |
| Decay time | sec | <0.3 | <0.3 | FTM 101C-4046 (23℃×15%RH) |
|
Adhesive strength (vs Glass) |
N/25mm | 0.38 | 0.38 | Peeling Speed : 300mm/min Peeling Angle : 170° |
| Outgassing | μg/g | 158 | 201 | 170℃ 10min. |
| Transparency rate | % | 78 | 46 | JIS K 7105 |
＊This data is an actual measurement value, not a guaranteed value.
